Revision 3.1

Board revision 3.1. Changes:

• Better silkscreen legibility by slightly moving some vias

Revision 3.0

Board revision 3.0. Changes:

• Complete redesign in Horizon EDA
• New prototyping field replacing the 0.05" grid
• New logo
• Silkrscreen text detailing all pin alternate functions and five-volt
  tolerant pins
• No default-shorted solder jumpers
• Replacement of IDD connector by 0805 shunt footprint
• Addition of VIN pin to SWD connector
• Addition of VIN and VDD pin to power input connector
• Power input connectors on left and right side of board
• Pads for top two mounting holes
• Untented vias except under MCU and ground vias

Revision 2.0

Board revision 2.0. Changes:

• The SD card now has a MOSFET, so it can be completely shut off
• More (hopefully useful) silkscreen text
• Logo on board

Revision 1.0

PCB revision 1.0.