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[Chef] Add heat pump device type #36457
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Changed Files
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PR #36457: Size comparison from 882b76e to a24e0d0 Full report (3 builds for cc32xx, stm32)
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Add new lines
PR #36457: Size comparison from 882b76e to cf9db78 Full report (3 builds for cc32xx, stm32)
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Add new lines
PR #36457: Size comparison from 882b76e to 20331c0 Full report (24 builds for bl602, bl702, bl702l, cc13x4_26x4, cc32xx, nrfconnect, qpg, stm32, telink, tizen)
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PowerSource Feature = WIRED
Waiting for PR matter-devices.xml: Fix DEM (Simple -> Utility) #36458 to add DEM device type in EP1 |
PR #36457: Size comparison from 882b76e to 5910c24 Full report (68 builds for bl602, bl702, bl702l, cc13x4_26x4, cc32xx, cyw30739, efr32, esp32, linux, nrfconnect, nxp, psoc6, qpg, stm32, telink, tizen)
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Add Device Energy Management in EP1
cluster DiagnosticLogs
PR #36457: Size comparison from dfd3749 to ba0f9d9 Full report (68 builds for bl602, bl702, bl702l, cc13x4_26x4, cc32xx, cyw30739, efr32, esp32, linux, nrfconnect, nxp, psoc6, qpg, stm32, telink, tizen)
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[Chef] Add heat pump device type.
Specification
This refers to the specification file
24-27351-005_Matter-1.4-Device-Library-Specification.pdf
page 161Build & run